So here we have, a fresh new leak. The Japanese magazine Mac Fan has once again1 got their hands on some detailed design schematics of the iPhone 7 Pro2. Apparently will the next iPhone have the same overall size as the iPhone 6s Plus, and will not have a 3.5mm headphone jack and have a dual camera lens on the back. As we seen before in other rumors.
Earlier rumors claimed that Apple would get rid of the 3.5mm headphone jack in favor of a thinner design, but this report claims that Apple will keep the same. More specifically, the iPhone 7 ‘Pro’ will come in at 7.3mm thick, which is the exact same as the iPhone 6s Plus and thicker than the iPhone 6 Plus, which was 6.9mm thick.
If you look closely at the schematics you can see that the dual camera is still protruding, and you can also see a Smart Connector on the back of the device. We can also clearly see a sim card slot and all the buttons in the same position as on the iPhone 6s Plus.
Personally I am a bit disappointed that it’s not thinner than the iPhone 6s Plus though, but hopefully it will at least be lighter.
So if this design is true3, then I probably won’t upgrade this year.
Via iPhone 7 ‘Pro’ schematics show up in Japanese mag w/ dual camera, sans headphone jack – 9to5Mac