![iPhone 7 schematics from a reliable source iPhone 7 schematics from a reliable source](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEh1pFxQdJs9BaYSrIVf8I-D2YLCakLUDmoS6bag8pSFgapJYDSGxf1uqhp43Fr2xNOxzkLheOVBjpqQbRCNm5AUNoqddjiMmpjHA6oCbMXrM2DYwnW_OlVIAw8Ru1xg6HCizZL1pQ/s640/large-5720df3ec5c0b.jpg)
So here we have, a fresh new leak. The Japanese magazine Mac Fan has once again1 got their hands on some detailed design schematics of the iPhone 7 Pro2. Apparently will the next iPhone have the same overall size as the iPhone 6s Plus, and will not have a 3.5mm headphone jack and have a dual camera lens on the back. As we seen before in other rumors.
Earlier rumors claimed that Apple would get rid of the 3.5mm headphone jack in favor of a thinner design, but this report claims that Apple will keep the same. More specifically, the iPhone 7 ‘Pro’ will come in at 7.3mm thick, which is the exact same as the iPhone 6s Plus and thicker than the iPhone 6 Plus, which was 6.9mm thick.
If you look closely at the schematics you can see that the dual camera is still protruding, and you can also see a Smart Connector on the back of the device. We can also clearly see a sim card slot and all the buttons in the same position as on the iPhone 6s Plus.
![A concept image of the iPhone 7 without headphone jack A concept image of the iPhone 7 without headphone jack](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEgSRNPQMLqyqlT_ZWd-s0QaUm43h4EhzrAMTq4tg6cdOnwKIEIfH0Zr4p3c7fjqHDW8Ax-76-eq6LcsoQzRwLbysBUQKGCEnoK35v3B1b_y6nw20OQ4npNo-dOgdh0HIP4BBq_vaA/s640/iphone-no-headphone-jack-2.jpg)
Personally I am a bit disappointed that it’s not thinner than the iPhone 6s Plus though, but hopefully it will at least be lighter.
So if this design is true3, then I probably won’t upgrade this year.
Via iPhone 7 ‘Pro’ schematics show up in Japanese mag w/ dual camera, sans headphone jack – 9to5Mac